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DSC1001DI1-004.9152 - Microchip

Description: 2 Line Common Mode Choke Surface Mount 90 Ohms @ 100 MHz 370mA DCR 300mOhm

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PCB Footprints
DSC1001DI1-004.9152 - Microchip PCB footprint - Other - Other - 4-Lead Very Thin Plastic Dual Flat, No Lead Package (J5A) - 2.5x2x0.9 mm Body [VDFN]
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3D Models
DSC1001DI1-004.9152 - Microchip  - 3D model - Other - 4-Lead Very Thin Plastic Dual Flat, No Lead Package (J5A) - 2.5x2x0.9 mm Body [VDFN]
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DSC1001DI1-004.9152 Details

  • Manufacturer Part Number:

    DSC1001DI1-004.9152

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-4

  • Pin Count:

    4

  • Manufacturer Package Code:

    VDFN-4

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    19

  • Additional Feature:

    AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TUBE

  • Fall Time-Max:

    2 ns

  • Frequency Adjustment-Mechanical:

    NO

  • Frequency Stability:

    50%

  • JESD-609 Code:

    e4

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    4

  • Operating Frequency-Nom:

    4.9152 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Oscillator Type:

    CMOS

  • Output Load:

    10 KOHM, 15 pF

  • Package Body Material:

    PLASTIC

  • Physical Dimension:

    2.5mm x 2.0mm x 0.85mm

  • Rise Time-Max:

    2 ns

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.7 V

  • Surface Mount:

    YES

  • Symmetry-Max:

    55/45 %

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

DSC1001DI1-004.9152 Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout in the device's application note (AN2005) and evaluation board documentation. It's essential to follow these guidelines to ensure optimal performance, especially for high-frequency signals.
  • Microchip provides a range of application notes and design guides that provide configuration examples and guidelines for specific use cases. Additionally, the device's datasheet and programming guide provide detailed information on register settings and configuration options.
  • The device's datasheet provides thermal management guidelines, including junction-to-ambient thermal resistance and recommended operating temperatures. Engineers should ensure proper heat sinking, PCB design, and thermal analysis to ensure reliable operation in high-temperature environments.
  • Microchip provides a range of troubleshooting resources, including application notes, FAQs, and technical support. Engineers can also use oscilloscopes, signal generators, and other test equipment to diagnose issues and optimize device performance.
  • The device's datasheet provides EMI and RFI guidelines, and Microchip recommends following proper PCB design and layout practices to minimize emissions. Engineers should also ensure compliance with relevant standards and regulations, such as FCC and CE, by performing necessary testing and certification.

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DSC1001DI1-004.9152 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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