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DSC9001S0L - Panasonic

Description: DSC9001S0L, NPN Bipolar Transistor, 100 mA 50 V HFE:290 150 MHz, 3-Pin SSMini3 F3 B

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Symbol
DSC9001S0L - Panasonic - PCB symbol
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PCB Footprints
DSC9001S0L - Panasonic PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - SSMini3-F2-B
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3D Models
DSC9001S0L - Panasonic - 3D model - SO Transistor Flat Lead - SSMini3-F2-B
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DSC9001S0L Details

  • Manufacturer Part Number:

    DSC9001S0L

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, SSMINI3-F3-B, SC-89, 3 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    Panasonic Electronic Components

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    290

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    NPN

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN BISMUTH

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    150 MHz

DSC9001S0L Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package is recommended for heat dissipation. A copper plane on the PCB with multiple vias to the thermal pad can help to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal gradients. Additionally, consider using thermal management techniques such as heat sinks or thermal interfaces.
  • The POR circuit ensures that the device resets properly during power-up. However, it may introduce a delay in system startup. Ensure that the system design takes into account this delay and that the device is properly reset before normal operation.
  • The WDT is designed to reset the device in case of a software fault. Ensure that the WDT is properly configured and that the system design includes a mechanism to reset the WDT periodically to prevent unwanted resets.
  • Ensure that the PCB is designed with EMC in mind, including proper grounding, shielding, and decoupling. Additionally, consider using EMC filters or common-mode chokes to minimize electromagnetic interference.

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DSC9001S0L Overview

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