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DSG5402PGE100 - Texas Instruments

Description: Digital Signal Processors & Controllers - DSP, DSC

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PCB Footprints
DSG5402PGE100 - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PGE (S-PQFP-G144)
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3D Models
DSG5402PGE100 - Texas Instruments  - 3D model - Quad Flat Packages - PGE (S-PQFP-G144)
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DSG5402PGE100 Details

  • Manufacturer Part Number:

    DSG5402PGE100

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Package Description:

    LQFP-144

  • Pin Count:

    144

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO OPERATES AT 3.3V SUPPLY

  • Address Bus Width:

    20

  • Barrel Shifter:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    50 MHz

  • External Data Bus Width:

    16

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e4

  • Length:

    20 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of DMA Channels:

    6

  • Number of External Interrupts:

    4

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    144

  • Number of Timers:

    2

  • On Chip Data RAM Width:

    16

  • On Chip Program ROM Width:

    16

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (words):

    16384

  • ROM Programmability:

    MROM

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    1.98 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    20 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

DSG5402PGE100 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout and thermal management guide in the DSG5402PGE100 evaluation module documentation. It's essential to follow these guidelines to ensure optimal performance, reduce thermal issues, and prevent damage to the device.
  • The DSG5402PGE100 has a complex configuration process. It's recommended to use the TI's WEBENCH Power Designer tool to generate a custom configuration based on your specific application requirements. This tool helps optimize the device's performance, reduces design time, and ensures correct configuration.
  • When selecting external components, it's crucial to consider the input and output capacitors, inductors, and resistors. Ensure that these components meet the recommended specifications and ratings outlined in the datasheet to prevent performance issues, noise, and instability.
  • To troubleshoot issues, start by verifying the PCB layout, component selection, and configuration. Use oscilloscopes and other debugging tools to identify the root cause. Consult the datasheet, application notes, and TI's support resources for guidance on resolving common issues.
  • The DSG5402PGE100 has a maximum junction temperature (TJ) of 150°C. Ensure proper thermal management by providing adequate heat sinking, airflow, and reducing power dissipation. Monitor the device's temperature and adjust the design accordingly to prevent thermal shutdown or damage.

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DSG5402PGE100 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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