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DSLVDS1001DBVR - Texas Instruments

Description: 400-Mbps LVDS single high speed differential driver

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PCB Footprints
DSLVDS1001DBVR - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - 5-Pin SOT-23
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3D Models
DSLVDS1001DBVR - Texas Instruments  - 3D model - SOT23 (5-Pin) - 5-Pin SOT-23
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DSLVDS1001DBVR Details

  • Manufacturer Part Number:

    DSLVDS1001DBVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOT-23, 5 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2018-08-04

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000015 A

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-644-A; TIA-644-A

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e0

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.35 V

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.45 mm

  • Supply Current-Max:

    10 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Transmit Delay-Max:

    1.5 ns

  • Width:

    1.6 mm

DSLVDS1001DBVR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 4-layer PCB with a solid ground plane and a separate power plane for the device. The device should be placed near the center of the board, and the input and output traces should be kept short and matched to minimize signal reflections.
  • To ensure signal integrity, use controlled impedance traces, keep the signal traces short and away from noise sources, and use termination resistors at the receiver end. Also, use a common mode filter or a ferrite bead to reduce electromagnetic interference (EMI).
  • The maximum cable length supported by the DSLVDS1001DBVR depends on the data rate and the type of cable used. As a general guideline, the device supports cable lengths up to 10 meters at 1.5 Gbps and up to 5 meters at 3 Gbps. However, the actual cable length may vary depending on the specific application and environment.
  • To troubleshoot issues with the DSLVDS1001DBVR, start by checking the power supply voltage and ensuring that it is within the recommended range. Then, check the input and output signals using an oscilloscope to identify any signal integrity issues. Also, check the device's temperature and ensure that it is within the recommended operating range.
  • The DSLVDS1001DBVR is rated for operation up to 85°C, but it can be used in high-temperature environments with proper thermal management. Ensure that the device is properly heatsinked and that the ambient temperature is within the recommended range.

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DSLVDS1001DBVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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