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DST847BPDP6-7 - Diodes Incorporated

Description: Bipolar Transistor Array, Complementary NPN and PNP, 45 V, 45 V, 100 mA, 100 mA, 300 mW

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DST847BPDP6-7 - Diodes Incorporated PCB footprint - Other - Other - DST847BPDP6-7-4
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DST847BPDP6-7 - Diodes Incorporated  - 3D model - Other - DST847BPDP6-7-4
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DST847BPDP6-7 Details

  • Manufacturer Part Number:

    DST847BPDP6-7

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    6

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    45 V

  • Configuration:

    SEPARATE, 2 ELEMENTS

  • DC Current Gain-Min (hFE):

    200

  • JESD-30 Code:

    S-PDSO-F6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN AND PNP

  • Power Dissipation-Max (Abs):

    0.25 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    175 MHz

DST847BPDP6-7 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and a thermal relief pattern on the top layer. This helps to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range (up to 125°C) and consider derating the device's power dissipation accordingly. Additionally, ensure good thermal management, such as using a heat sink or thermal interface material.
  • The DST847BPDP6-7 has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during assembly and handling. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • Yes, the DST847BPDP6-7 is suitable for high-reliability and automotive applications. It meets the AEC-Q100 qualification standard, ensuring it can withstand the harsh conditions found in these environments.
  • The recommended soldering conditions for the DST847BPDP6-7 are: peak temperature of 260°C, soldering time of 10 seconds, and a soldering iron temperature of 350°C. Ensure that the device is not exposed to excessive thermal stress during the soldering process.

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DST847BPDP6-7 Overview

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