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DTA014EUBTL - ROHM Semiconductor

Description: PNP, SOT-323FL, R1=R2 Potential Divider Type Digital Transistor (Bias Resistor Built-in Transistor)

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PCB Footprints
DTA014EUBTL - ROHM Semiconductor PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - sot323-3
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3D Models
DTA014EUBTL - ROHM Semiconductor  - 3D model - SO Transistor Flat Lead - sot323-3
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DTA014EUBTL Details

  • Manufacturer Part Number:

    DTA014EUBTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, UMT3F, SC-85, 3 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Additional Feature:

    BUILT IN BIAS RESISTANCE RATIO IS 1

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    35

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    250 MHz

DTA014EUBTL Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, and to use thermal vias to dissipate heat to the bottom layer. Additionally, keeping the thermal pad away from other components and traces can help reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, ensure good thermal design, and consider using a heat sink or thermal interface material. Additionally, derating the device's power consumption and using a thermal protection circuit can help prevent overheating.
  • The DTA014EUBTL has built-in ESD protection, but it's still essential to follow proper handling and assembly procedures to prevent ESD damage. For latch-up prevention, it's recommended to use a latch-up prevention circuit or to ensure that the device is operated within the recommended operating conditions.
  • To optimize the device's performance for low-power applications, consider using a low-dropout regulator, optimizing the power supply voltage, and using power-saving modes. Additionally, reducing the switching frequency, using a low-power mode, and optimizing the output capacitor value can help minimize power consumption.
  • To prevent damage, it's essential to store the device in a dry, cool place, away from direct sunlight and moisture. During handling, use anti-static wrist straps, mats, or bags to prevent ESD damage. Avoid bending or flexing the leads, and handle the device by the body, not the leads.

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DTA014EUBTL Overview

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