ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range (Ta = -40°C to 125°C) and consider the device's power dissipation. Implement thermal management techniques, such as heat sinks or thermal interfaces, to keep the junction temperature (Tj) below the maximum rating (150°C).
ROHM recommends using a low-ESR ceramic capacitor (X5R or X7R dielectric) with a value between 1uF to 10uF, depending on the specific application requirements. The input capacitor should be placed as close as possible to the VIN pin to minimize noise and ensure stable operation.
To prevent EOS and ESD damage, follow proper handling and assembly procedures. Use ESD-protective equipment, such as wrist straps and mats, during handling and assembly. Ensure that the device is powered down during assembly and testing, and avoid applying voltage or current exceeding the recommended maximum ratings.
ROHM recommends using a low-ESR ceramic capacitor (X5R or X7R dielectric) with a value between 1uF to 10uF, depending on the specific application requirements. The output capacitor should be placed as close as possible to the VOUT pin to minimize noise and ensure stable operation.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
DTB114ECT116 Overview
Use the download button to access the DTB114ECT116 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like DTB11,
or try a keyword search, such as Small Signal Bipolar Transistors
