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DTC014TEBTL - ROHM Semiconductor

Description: NPN, SOT-416FL, R1 Alone Type Digital Transistor (Bias Resistor Built-in Transistor)

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DTC014TEBTL - ROHM Semiconductor PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - DTC014TEBTL
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DTC014TEBTL - ROHM Semiconductor  - 3D model - SO Transistor Flat Lead - DTC014TEBTL
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DTC014TEBTL Details

  • Manufacturer Part Number:

    DTC014TEBTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, EMT3F, SC-89, 3 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    100

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    250 MHz

DTC014TEBTL Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the DTC014TEBTL is -40°C to 125°C.
  • To handle ESD sensitivity, use an ESD wrist strap or mat, and follow proper handling and storage procedures to prevent damage from static electricity.
  • The maximum power dissipation for the DTC014TEBTL is 250mW. Ensure that the device is operated within this limit to prevent overheating and damage.
  • While the DTC014TEBTL is designed to operate in a wide range of temperatures, it's not recommended for use in high-humidity environments. If necessary, consider using a moisture-resistant coating or conformal coating to protect the device.
  • To ensure reliability, follow proper design and manufacturing guidelines, use a robust PCB design, and implement adequate thermal management. Additionally, consider using a redundant design or error correction mechanisms to mitigate potential failures.

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