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DTC114EEFRATL - ROHM Semiconductor

Description: NPN, SOT-416, R1=R2 Potential Divider Type Digital Transistor (Bias Resistor Built-in Transistor) for automotive

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PCB Footprints
DTC114EEFRATL - ROHM Semiconductor PCB footprint - Other - Other - SOT-416_2025
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DTC114EEFRATL - ROHM Semiconductor  - 3D model - Other - SOT-416_2025
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DTC114EEFRATL Details

  • Manufacturer Part Number:

    DTC114EEFRATL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-75A, 3 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00.75

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Additional Feature:

    BUILT IN BIAS RESISTANCE RATIO IS 1

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    30

  • JESD-30 Code:

    R-PDSO-G3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation Ambient-Max:

    0.15 W

  • Power Dissipation-Max (Abs):

    0.15 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    250 MHz

DTC114EEFRATL Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are also recommended.
  • Ensure that the device is operated within the recommended temperature range (Ta = -40°C to 150°C). Use a heat sink or thermal interface material to reduce thermal resistance.
  • The maximum allowable voltage on the input pins is VCC + 0.5V to prevent damage to the device.
  • Use ESD-protective packaging, wrist straps, and mats during handling and assembly. Ground all equipment and personnel to prevent static buildup.
  • Store the device in a dry, cool place (RH < 60%, T < 30°C) to prevent moisture absorption and damage.

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