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DTC114EKAT146 - ROHM Semiconductor

Description: Digital NPN transistor array,DTC114EKA ROHM, DTC114EKAT146 NPN Digital Transistor, 100 mA 10 kΩ, Ratio Of 1, 3-Pin SMT

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PCB Footprints
DTC114EKAT146 - ROHM Semiconductor PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SMT3
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DTC114EKAT146 - ROHM Semiconductor  - 3D model - SOT23 (3-Pin) - SMT3
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DTC114EKAT146 Details

  • Manufacturer Part Number:

    DTC114EKAT146

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-59

  • Package Description:

    SC-59, 3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00.75

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Additional Feature:

    BUILT IN BIAS RESISTOR RATIO IS 1

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    30

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation Ambient-Max:

    0.2 W

  • Power Dissipation-Max (Abs):

    0.2 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    250 MHz

  • VCEsat-Max:

    0.3 V

DTC114EKAT146 Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended temperature range (Ta = -40°C to 150°C). Use a heat sink or thermal interface material to reduce thermal resistance. Monitor the junction temperature (Tj) to prevent overheating.
  • The maximum allowable voltage on the input pins is 5.5V. Exceeding this voltage may cause damage to the device.
  • To prevent latch-up, ensure that the input signals are not simultaneously driven high and low. Use a series resistor or a current-limiting resistor to prevent excessive current flow.
  • Power up the device in the following sequence: VCC, then input signals. This ensures that the device is properly initialized and prevents unwanted behavior.

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DTC114EKAT146 Overview

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