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DTC114YET1G - onsemi

Description: Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant

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Symbol
DTC114YET1G - onsemi - PCB symbol
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PCB Footprints
DTC114YET1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC-75/SOT-416 CASE 463
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3D Models
DTC114YET1G - onsemi - 3D model - SOT23 (3-Pin) - SC-75/SOT-416 CASE 463
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DTC114YET1G Details

  • Manufacturer Part Number:

    DTC114YET1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-75 (SOT-416) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    463-01

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Additional Feature:

    BUILT-IN BIAS RESISTOR RATIO IS 0.21

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    80

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.3 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DTC114YET1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device can help to dissipate heat efficiently. The datasheet provides a recommended land pattern, but a more detailed layout guide can be found in the onsemi application note AND8325/D.
  • The DTC114YET1G requires a stable voltage supply and proper biasing to operate within its specifications. Ensure that the input voltage is within the recommended range (4.5V to 5.5V) and that the bias resistors are chosen to provide the recommended current (10mA to 20mA).
  • The maximum power dissipation for the DTC114YET1G is 1.4W. However, this value can be affected by the ambient temperature, PCB layout, and other factors. It's essential to perform thermal calculations and simulations to ensure the device operates within its thermal limits.
  • Yes, the DTC114YET1G is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q101 standard and is manufactured using a process that ensures high reliability and low defect rates.
  • Start by verifying the device is properly biased and that the input voltage is within the recommended range. Check for any signs of overheating, and ensure that the PCB layout is correct. If the issue persists, consult the onsemi support team or a qualified engineer for further assistance.

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DTC114YET1G Overview

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