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DTC123EETL - ROHM Semiconductor

Description: DTC123E series - NPN 100mA 50V Digital Transistor Pre-Biased 50 V Surface Mount EMT3, -55°C to +150°C

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PCB Footprints
DTC123EETL - ROHM Semiconductor PCB footprint - Other - Other - EMT3_2026
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DTC123EETL - ROHM Semiconductor  - 3D model - Other - EMT3_2026
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DTC123EETL Details

  • Manufacturer Part Number:

    DTC123EETL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-75A

  • Package Description:

    ROHS COMPLIANT, EMT3, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Additional Feature:

    BUILT-IN BIAS RESISTOR RATIO IS 1

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    20

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.15 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    250 MHz

  • VCEsat-Max:

    0.3 V

DTC123EETL Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended temperature range (Ta = -40°C to 150°C). Use a heat sink or thermal interface material to reduce thermal resistance. Monitor the junction temperature (Tj) to prevent overheating.
  • The maximum allowed voltage on the input pins is 5.5V. Exceeding this voltage may cause damage to the device.
  • Use an ESD wrist strap or mat during handling and assembly. Ensure that the device is stored in an anti-static bag or container. Avoid touching the device pins or handling the device in a way that may generate static electricity.
  • Use a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 10-30 seconds. Avoid exceeding 280°C (536°F) to prevent damage to the device.

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DTC123EETL Overview

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