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DTC123JET1G - onsemi

Description: Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant

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PCB Footprints
DTC123JET1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC−75/SOT−416,
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3D Models
DTC123JET1G - onsemi  - 3D model - SOT23 (3-Pin) - SC−75/SOT−416,
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DTC123JET1G Details

  • Manufacturer Part Number:

    DTC123JET1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-75 (SOT-416) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    463-01

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Additional Feature:

    BUILT-IN BIAS RESISTOR RATIO IS 0.047

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    80

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.3 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DTC123JET1G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DTC123JET1G is a standard SOT-23 package with a 1.3mm x 1.3mm body size and a 0.5mm pitch. A minimum pad size of 0.6mm x 0.6mm is recommended for reliable soldering.
  • To ensure reliable operation of the DTC123JET1G in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking and airflow, and ensuring that the device is operated within its specified temperature range of -40°C to 150°C.
  • The maximum allowed voltage on the input pins of the DTC123JET1G is 5.5V. Exceeding this voltage may cause damage to the device.
  • The DTC123JET1G has built-in ESD protection, but it is still recommended to follow proper ESD handling practices, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging.
  • The recommended storage temperature range for the DTC123JET1G is -40°C to 150°C. Storage outside of this range may affect the device's reliability and performance.

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DTC123JET1G Overview

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