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DTC143EU3T106 - ROHM Semiconductor

Description: NPN, SOT-323, R1=R2 Potential Divider Type Digital Transistor (Bias Resistor Built-in Transistor)

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PCB Footprints
DTC143EU3T106 - ROHM Semiconductor PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-323FL SC-85 (UMT3f)
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3D Models
DTC143EU3T106 - ROHM Semiconductor  - 3D model - SOT23 (3-Pin) - SOT-323FL SC-85 (UMT3f)
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DTC143EU3T106 Details

  • Manufacturer Part Number:

    DTC143EU3T106

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-70, 3 PIN

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2018-01-17

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Additional Feature:

    BUILT IN BIAS RESISTANCE RATIO IS 1

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    30

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    250 MHz

DTC143EU3T106 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DTC143EU3T106 is a 0402 package with a land pattern of 0.5mm x 0.3mm. It's essential to follow the recommended footprint to ensure proper soldering and thermal performance.
  • To handle thermal considerations, ensure a good thermal connection between the device and the PCB. Use a thermal pad or a thermal via to dissipate heat. Keep the device away from heat sources, and use a heat sink if necessary. Follow the thermal design guidelines in the datasheet.
  • The maximum operating temperature range for the DTC143EU3T106 is -40°C to 125°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range.
  • Yes, the DTC143EU3T106 is suitable for high-frequency applications up to 100 MHz. However, ensure that the PCB layout and component selection are optimized for high-frequency operation to minimize signal loss and distortion.
  • To ensure reliability in a humid environment, follow the recommended storage and handling procedures. Use a moisture barrier bag or a dry box to store the devices. Avoid exposing the devices to moisture, and use a conformal coating or potting compound to protect the device from humidity.

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DTC143EU3T106 Overview

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