ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink or thermal management system to keep the device temperature within the recommended range.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time above 240°C of 30-60 seconds, and a total process time of 60-120 seconds. It's essential to follow the recommended soldering profile to prevent damage to the device.
To prevent ESD damage, handle the devices with an anti-static wrist strap or mat, and ensure that the assembly line and equipment are ESD-protected. Additionally, consider using ESD-protective packaging and storage materials.
ROHM recommends storing the devices in a dry, cool place, away from direct sunlight and moisture. The storage temperature should be between -10°C and 30°C, and the humidity should be below 60%. Avoid storing the devices in environments with high temperatures, humidity, or exposure to chemicals.
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DTC144EE3HZGTL Overview
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