ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink or thermal management system to keep the device temperature within the recommended range.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time above 240°C of 30-60 seconds, and a total process time of 60-120 seconds. It's essential to follow the recommended soldering profile to prevent damage to the device.
The DTC144EMFHAT2L is not hermetically sealed, so it's not recommended for use in high-humidity environments. If you need to operate the device in a humid environment, consider using a conformal coating or potting the device to protect it from moisture.
ROHM recommends storing the DTC144EMFHAT2L in a dry, dark place with a temperature range of 5°C to 30°C and humidity below 60%. Avoid storing the device in direct sunlight or near heat sources.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
DTC144EMFHAT2L Overview
Use the download button to access the DTC144EMFHAT2L 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like DTC14,
or try a keyword search, such as Small Signal Bipolar Transistors
