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DTD123YCT116 - ROHM Semiconductor

Description: NPN, SOT-23, R1≠R2 Leak Absorption Type Digital Transistor (Bias Resistor Built-in Transistor)

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PCB Footprints
DTD123YCT116 - ROHM Semiconductor PCB footprint - Other - Other - SOT-23(SST3)_2021
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3D Models
DTD123YCT116 - ROHM Semiconductor  - 3D model - Other - SOT-23(SST3)_2021
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DTD123YCT116 Details

  • Manufacturer Part Number:

    DTD123YCT116

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    MINIMOLD, SST, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Additional Feature:

    DIGITAL, BUILT-IN BIAS RESISTOR RATIO IS 4.5

  • Collector Current-Max (IC):

    0.5 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    56

  • JESD-30 Code:

    R-PDSO-G3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    200 MHz

  • VCEsat-Max:

    0.3 V

DTD123YCT116 Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package is recommended for optimal thermal performance. A 2-layer or 4-layer PCB with a thermal via connecting the thermal pad to a large copper area on the bottom layer is recommended.
  • Use a reflow soldering process with a peak temperature of 240°C or less. Avoid exposing the device to temperatures above 260°C. Use a soldering iron with a temperature of 350°C or less, and avoid applying excessive force or pressure.
  • Power on the VDD pin first, followed by the SCL and SDA pins. This ensures proper initialization of the device.
  • Verify the I2C bus voltage, clock frequency, and signal integrity. Check for bus contention, incorrect pin connections, or incorrect I2C address configuration. Use an oscilloscope to analyze the I2C bus signals.
  • The typical current consumption is 10 μA in normal operation mode and 1 μA in sleep mode.

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DTD123YCT116 Overview

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