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E-TEA3718DP - STMicroelectronics

Description: STMICROELECTRONICS - E-TEA3718DP - Stepper Motor Driver Circuit, Thermal Protection, 50V to 5V supply, 45V/1.5A/2 Outputs, DIP-16

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E-TEA3718DP - STMicroelectronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - Power DIP16
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E-TEA3718DP - STMicroelectronics  - 3D model - Dual-In-Line Packages - Power DIP16
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E-TEA3718DP Details

  • Manufacturer Part Number:

    E-TEA3718DP

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    POWER, DIP-16

  • Pin Count:

    16

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    25 Weeks

  • Manufacturer:

    STMicroelectronics

  • Additional Feature:

    ALSO REQUIRES A 10 TO 45 V SUPPLY

  • Analog IC - Other Type:

    STEPPER MOTOR CONTROLLER

  • JESD-30 Code:

    R-PDIP-T16

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Output Current-Max:

    1.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.1 mm

  • Supply Current-Max (Isup):

    25 mA

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    4.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

E-TEA3718DP Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C.
  • Use a shielded enclosure, ensure proper grounding, and implement EMI filters on input/output lines. Follow STMicroelectronics' application notes for EMI and EMC guidelines.
  • Use the device's low-power modes, optimize the clock frequency, and minimize the number of active circuits. Implement power gating and dynamic voltage and frequency scaling (DVFS) techniques.
  • Use 100nF to 1uF decoupling capacitors, placed as close as possible to the device's power pins. Follow the datasheet's recommended decoupling capacitor placement diagram.

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E-TEA3718DP Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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