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E7150-102A49-AG - onsemi

Description: Last Shipments - EEPROM Serial 2-Mb SPI Low-Power

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E7150-102A49-AG - onsemi - PCB symbol
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PCB Footprints
E7150-102A49-AG - onsemi PCB footprint - BGA - BGA - EZAIRO 7150 SL
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3D Models
E7150-102A49-AG - onsemi - 3D model - BGA - EZAIRO 7150 SL
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E7150-102A49-AG Details

  • Manufacturer Part Number:

    E7150-102A49-AG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SIP-49

  • Package Description:

    SIP-49

  • Manufacturer Package Code:

    127DQ

  • Country Of Origin:

    Canada

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks, 6 Days

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    IT ALSO HAS OPERATING TEMPERATURE 0 TO 50

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    R-PBGA-B49

  • Length:

    7.39 mm

  • Number of Functions:

    1

  • Number of Terminals:

    49

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.778 mm

  • Supply Voltage-Max (Vsup):

    2 V

  • Supply Voltage-Min (Vsup):

    1.05 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.686 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    3.94 mm

E7150-102A49-AG Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2oz copper thickness and a thermal via array under the package is recommended.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • The E7150-102A49-AG has built-in ESD protection, but it is still recommended to follow standard ESD handling precautions during assembly and testing. A minimum of 2kV HBM and 100V MM protection is recommended.
  • Yes, the E7150-102A49-AG is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards.
  • The recommended soldering conditions are: peak temperature 260°C, time above 217°C 30s, and time above 183°C 60s. A nitrogen atmosphere is recommended to minimize oxidation.

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E7150-102A49-AG Overview

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