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ECA1EHG331 - Panasonic

Description: Panasonic 330µF 25V dc Aluminium Electrolytic Capacitor, Through Hole 8 (Dia.) x 11.5mm +105°C 8mm 3.5mm

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ECA1EHG331 - Panasonic - PCB symbol
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PCB Footprints
ECA1EHG331 - Panasonic PCB footprint - Capacitor, Polarized Radial Diameter - Capacitor, Polarized Radial Diameter - 8*11.5_
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3D Models
ECA1EHG331 - Panasonic - 3D model - Capacitor, Polarized Radial Diameter - 8*11.5_
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ECA1EHG331 Details

  • Manufacturer Part Number:

    ECA1EHG331

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    RADIAL LEADED

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.22.00.20

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    7

  • Capacitance:

    330 µF

  • Capacitor Type:

    ALUMINUM ELECTROLYTIC CAPACITOR

  • Diameter:

    8 mm

  • Dielectric Material:

    ALUMINUM (WET)

  • JESD-609 Code:

    e3

  • Leakage Current:

    0.0825 mA

  • Length:

    11.5 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    CYLINDRICAL PACKAGE

  • Package Style:

    Radial

  • Packing Method:

    Bulk

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    25 V

  • Reference Standard:

    AEC-Q200

  • Ripple Current:

    310 mA

  • Surface Mount:

    NO

  • Tan Delta:

    0.16

  • Terminal Finish:

    Tin (Sn)

  • Terminal Pitch:

    3.5 mm

  • Terminal Shape:

    WIRE

ECA1EHG331 Frequently Asked Questions (FAQs)

  • The recommended land pattern for ECA1EHG331 is a rectangular pad with a size of 2.5mm x 1.25mm, with a solder mask clearance of 0.1mm. It's also recommended to have a via-in-pad design to reduce thermal resistance.
  • To handle thermal management, ensure good thermal conductivity between the component and the PCB by using a thermal interface material (TIM) and a heat sink. Also, keep the component away from heat sources and ensure good airflow around the component.
  • The maximum operating temperature range for ECA1EHG331 is -40°C to +125°C. However, the component's performance and lifespan may degrade if operated at the extreme ends of this range for an extended period.
  • Yes, ECA1EHG331 is designed to withstand vibrations up to 10G (10Hz to 2000Hz). However, it's recommended to follow proper mounting and soldering techniques to ensure the component's reliability in high-vibration environments.
  • Store ECA1EHG331 in a dry, cool place with a relative humidity of 60% or less. Avoid storing the component in a sealed package for an extended period, as this can cause moisture to become trapped inside. If the component is exposed to moisture, bake it at 125°C for 24 hours to remove any absorbed moisture.

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ECA1EHG331 Overview

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For a full list of alternate parts for ECA1EHG331, check out Findchips.com