Description:Standard Clock Oscillators ECS-2532HS,OSC XO 50.000MHZ CMOS SMD,3.3V,+/-10ppm,-40+/-C 85+/-C,10mA,Surface Mount,0.126" L x 0.098" W (3.20mm x 2.50mm),0.039" (1.00mm)
The recommended PCB layout involves keeping the power planes and ground planes separate, using thermal vias to dissipate heat, and placing the device near a heat sink or thermal pad. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended. For thermal management, a heat sink with a thermal conductivity of at least 1 W/m-K is recommended, and the device should be placed in a well-ventilated area.
To ensure EMC, it is recommended to use a metal shield around the device, keep the device at least 10 mm away from other components, and use a common-mode choke or ferrite bead to filter out electromagnetic interference (EMI). Additionally, the device should be placed in a shielded enclosure and connected to a grounded metal chassis.
The maximum operating temperature range for the ECS-2532HS-500-3-G is -40°C to 125°C. However, the device's performance and reliability may degrade if operated at temperatures above 85°C for extended periods.
Yes, the ECS-2532HS-500-3-G is designed to withstand high-vibration environments. However, it is recommended to follow the manufacturer's guidelines for vibration testing and to ensure that the device is properly secured to the PCB and the PCB is securely attached to the chassis.
The ECS-2532HS-500-3-G should be stored in a dry, cool place away from direct sunlight and moisture. The device should be handled with anti-static wrist straps or mats to prevent electrostatic discharge (ESD) damage. The device should not be exposed to temperatures above 30°C or humidity above 60% during storage.
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ECS-2532HS-500-3-G Overview
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