Part Image

EDF8132A1MC-GD-F-R - Micron

Description: 178-Ball 2C0F Single-Channel Mobile LPDDR3 SDRAM

Download EDF8132A1MC-GD-F-R Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
EDF8132A1MC-GD-F-R - Micron PCB footprint - BGA - BGA - 178-Ball FBGA (12.0mm x 11.5mm)
click to zoom
3D Models
EDF8132A1MC-GD-F-R - Micron  - 3D model - BGA - 178-Ball FBGA (12.0mm x 11.5mm)
click to zoom

EDF8132A1MC-GD-F-R Details

  • Manufacturer Part Number:

    EDF8132A1MC-GD-F-R

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FBGA-178

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.36

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    0

  • Access Mode:

    DUAL BANK PAGE BURST

  • Additional Feature:

    AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM

  • JESD-30 Code:

    R-PBGA-B178

  • Length:

    12 mm

  • Memory Density:

    8589934592 bit

  • Memory IC Type:

    DDR DRAM

  • Memory Width:

    32

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    178

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    SYNCHRONOUS

  • Organization:

    256MX32

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    0.9 mm

  • Self Refresh:

    YES

  • Supply Voltage-Max (Vsup):

    1.3 V

  • Supply Voltage-Min (Vsup):

    1.14 V

  • Supply Voltage-Nom (Vsup):

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    11.5 mm

EDF8132A1MC-GD-F-R Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for EDF8132A1MC-GD-F-R is -40°C to 85°C, as specified in the datasheet. However, it's recommended to operate within -20°C to 70°C for optimal performance and reliability.
  • The power-up and power-down sequences for EDF8132A1MC-GD-F-R should be handled according to the datasheet's recommended power-up and power-down sequences. This typically involves ramping up the VCC power supply to the device before applying clock and input signals, and reversing this sequence during power-down.
  • The recommended PCB layout and routing for EDF8132A1MC-GD-F-R involves following good high-speed design practices, such as using short, direct traces for clock and data signals, and avoiding vias and stubs. It's also recommended to use a solid ground plane and to decouple the power supply with capacitors.
  • To troubleshoot issues with EDF8132A1MC-GD-F-R, start by verifying the power supply and clock signals, then check the data signals and protocol compliance. Use oscilloscopes and logic analyzers to capture and analyze the signals, and consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • Yes, EDF8132A1MC-GD-F-R is a high-speed device that can be susceptible to electromagnetic interference (EMI) and radio-frequency interference (RFI). To minimize these effects, use shielding, filtering, and grounding techniques, and follow good PCB layout and routing practices.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

EDF8132A1MC-GD-F-R Overview

Use the download button to access the EDF8132A1MC-GD-F-R schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like EDF81, or try a keyword search, such as DRAMs

Parts related to EDF8132A1MC-GD-F-R

Showing 0 results