The recommended land pattern for EEUFM1E471L is a rectangular pad with a size of 3.5mm x 2.5mm, with a solder mask opening of 3.1mm x 2.1mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
The ESR of EEUFM1E471L is typically around 0.15 ohms. To minimize the impact of ESR, it's recommended to use a low-ESR capacitor in parallel with EEUFM1E471L, and to optimize the PCB layout to reduce parasitic inductance and resistance.
EEUFM1E471L is rated for operation up to 125°C, but its performance may degrade at high temperatures. If your design requires operation above 105°C, it's recommended to derate the capacitor's voltage and current ratings accordingly.
To ensure the reliability of EEUFM1E471L, follow proper PCB design and assembly guidelines, including using a robust soldering process, avoiding excessive mechanical stress, and providing adequate clearance from nearby components.
EEUFM1E471L is designed to withstand moderate vibration levels, but extreme vibration may cause the capacitor to fail. If your design requires operation in a high-vibration environment, consider using a capacitor with enhanced vibration resistance or adding mechanical support to the component.
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EEUFM1E471L Overview
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