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EEUFM1E681 - Panasonic

Description: PANASONIC ELECTRONIC COMPONENTS - EEU-FM1E681 - \u94DD\u7535\u89E3\u7535\u5BB9, 680UF, 25V, \u5F84\u5411\u5F15\u7EBF

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Symbol
EEUFM1E681 - Panasonic - PCB symbol
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PCB Footprints
EEUFM1E681 - Panasonic PCB footprint - Capacitor, Polarized Radial Diameter - Capacitor, Polarized Radial Diameter - EEU-FM1E681
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3D Models
EEUFM1E681 - Panasonic - 3D model - Capacitor, Polarized Radial Diameter - EEU-FM1E681
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EEUFM1E681 Details

  • Manufacturer Part Number:

    EEUFM1E681

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    RADIAL LEADED

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.22.00.20

  • Factory Lead Time:

    30 Weeks, 1 Day

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    6

  • Capacitance:

    680 µF

  • Capacitor Type:

    ALUMINUM ELECTROLYTIC CAPACITOR

  • Diameter:

    10 mm

  • Dielectric Material:

    ALUMINUM (WET)

  • JESD-609 Code:

    e3

  • Leakage Current:

    0.17 mA

  • Length:

    20 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Shape:

    CYLINDRICAL PACKAGE

  • Package Style:

    Radial

  • Packing Method:

    BULK

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    25 V

  • Ripple Current:

    1635 mA

  • Surface Mount:

    NO

  • Tan Delta:

    0.14

  • Terminal Finish:

    Tin (Sn)

  • Terminal Pitch:

    5 mm

  • Terminal Shape:

    WIRE

EEUFM1E681 Frequently Asked Questions (FAQs)

  • The recommended land pattern for EEUFM1E681 is a rectangular pad with a size of 3.5mm x 2.5mm, with a solder mask opening of 3.1mm x 2.1mm. It's also recommended to have a thermal pad with a size of 2.5mm x 2.5mm.
  • To handle the power dissipation of EEUFM1E681, it's recommended to use a heat sink or a thermal pad to dissipate the heat. The device can dissipate up to 1.5W of power, and the thermal resistance (Rth) is 10°C/W. It's also important to ensure good airflow around the device.
  • The recommended operating temperature range for EEUFM1E681 is -40°C to 105°C. However, the device can operate up to 125°C for a short period of time, but this may affect its reliability and lifespan.
  • To ensure the reliability of EEUFM1E681 in high-vibration environments, it's recommended to use a robust mounting method, such as screwing or adhesive bonding, to secure the device to the PCB. Additionally, it's recommended to use a conformal coating to protect the device from moisture and contaminants.
  • The equivalent series resistance (ESR) of EEUFM1E681 is 1.5 ohms maximum at 100kHz. This value can affect the device's performance and efficiency, especially in high-frequency applications.

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EEUFM1E681 Overview

Use the download button to access the EEUFM1E681 schematic symbol, PCB footprint, and 3D model.
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EEUFM1E681 Alternates

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Part Image B41859C5687M008 TDK Corporation

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Part Image NRSK681M25V10X20TBF NIC Components Corp

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For a full list of alternate parts for EEUFM1E681, check out Findchips.com