The recommended land pattern for EEUFR1A332 is a rectangular pad with a size of 3.5mm x 2.5mm, with a solder mask opening of 3.1mm x 2.1mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
During reflow soldering, the EEUFR1A332 should be placed on the PCB with the capacitor body facing upwards. The recommended reflow profile is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 220°C. The component should be cooled down to 180°C within 60 seconds after the peak temperature.
Yes, the EEUFR1A332 is designed to withstand high-vibration environments. It has a vibration endurance of 10-2000Hz, 1.5mm amplitude, and 3 hours per axis. However, it's recommended to perform additional testing and validation to ensure the component meets the specific requirements of your application.
The EEUFR1A332 has a maximum operating temperature of 125°C, with a derating of 1.25% per °C above 85°C. The component's capacitance and ESR may change with temperature, so it's essential to consider these factors when designing your application.
Yes, the EEUFR1A332 is compatible with lead-free soldering. It's designed to meet the requirements of the RoHS directive and can be soldered using lead-free solder alloys such as SnAgCu.
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EEUFR1A332 Overview
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