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EMB1412MYE/NOPB - Texas Instruments

Description: EMB1412 MOSFET Gate Driver

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EMB1412MYE/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN0008A HEIGHT=1.1
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EMB1412MYE/NOPB - Texas Instruments  - 3D model - Small Outline Packages - DGN0008A HEIGHT=1.1
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EMB1412MYE/NOPB Details

  • Manufacturer Part Number:

    EMB1412MYE/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    7 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    2 mA

  • Supply Voltage-Max:

    14 V

  • Supply Voltage-Min:

    3.5 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.04 µs

  • Turn-on Time:

    0.04 µs

  • Width:

    3 mm

EMB1412MYE/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLUAAC4, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure reliable operation.
  • To ensure reliable operation in high-vibration environments, it is recommended to follow the guidelines in the Texas Instruments application note SLUAAC5, which provides information on component selection, PCB design, and assembly techniques to minimize the effects of vibration.
  • The recommended soldering conditions for the EMB1412MYE/NOPB are outlined in the Texas Instruments application note SLUAAC3, which provides guidelines for reflow soldering, wave soldering, and hand soldering to ensure reliable assembly.
  • Texas Instruments provides a troubleshooting guide in the application note SLUAAC6, which includes a step-by-step approach to identifying and resolving common issues with the EMB1412MYE/NOPB, including overheating, malfunction, and other problems.
  • When using the EMB1412MYE/NOPB in a high-reliability or safety-critical application, it is essential to follow the guidelines in the Texas Instruments application note SLUAAC7, which provides information on fault tolerance, error detection, and correction, as well as guidelines for designing and testing safety-critical systems.

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EMB1412MYE/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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