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EMD22FHAT2R - ROHM Semiconductor

Description: ROHM - EMD22FHAT2R - RF TRANSISTOR, AEC-Q101, NPN/PNP, 50V

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Symbol
EMD22FHAT2R - ROHM Semiconductor - PCB symbol
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PCB Footprints
EMD22FHAT2R - ROHM Semiconductor PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - SOT-563 (EMT6)
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3D Models
EMD22FHAT2R - ROHM Semiconductor - 3D model - SO Transistor Flat Lead - SOT-563 (EMT6)
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EMD22FHAT2R Details

  • Manufacturer Part Number:

    EMD22FHAT2R

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-107C, 6 PIN

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Additional Feature:

    BUILT IN BIAS RESISTANCE RATIO IS 10

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    80

  • JESD-30 Code:

    R-PDSO-F6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN AND PNP

  • Power Dissipation-Max (Abs):

    0.15 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    250 MHz

EMD22FHAT2R Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are also recommended.
  • Ensure that the device is operated within the recommended temperature range (-40°C to 125°C). Use a heat sink or thermal interface material to reduce thermal resistance. Avoid exceeding the maximum junction temperature (Tj) of 150°C.
  • Handle the device by the body, avoiding touching the pins. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and handling procedures to prevent ESD damage.
  • Check the power supply voltage and ensure it is within the recommended range. Verify that the input voltage is stable and free of noise. Check for proper pin connections and ensure that the device is not damaged or counterfeit.
  • Use a multi-layer PCB with a solid ground plane to reduce EMI. Keep the device away from high-frequency components and use shielding or filtering to minimize radiation. Follow good PCB design practices, such as minimizing trace lengths and using decoupling capacitors.

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EMD22FHAT2R Overview

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