A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are suggested. Refer to ROHM's application note for detailed guidelines.
Use a buffer circuit or an op-amp with a low input impedance to stabilize the input signal. Additionally, ensure the input signal is within the recommended voltage range to prevent oscillations.
The maximum power dissipation is dependent on the ambient temperature and PCB design. As a general guideline, the maximum power dissipation is 1.5W at 25°C ambient temperature. Refer to the thermal derating curve in the datasheet for more information.
Yes, the EMD9T2R is AEC-Q100 qualified and suitable for automotive and high-reliability applications. However, ensure that the device is used within the recommended operating conditions and follow ROHM's guidelines for automotive applications.
The EMD9T2R has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protected environment.
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EMD9T2R Overview
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