ROHM recommends a 4-layer PCB with a solid ground plane on the bottom layer, and a microstrip line layout for the high-frequency signals. A good layout should also minimize the distance between the EMH3T2R and the antenna, and ensure that the RF traces are as short and direct as possible.
The choice of external components such as capacitors, inductors, and resistors depends on the specific application and frequency band of operation. ROHM provides a reference design and a component selection guide in the application note, which can be used as a starting point for component selection.
The maximum power handling capability of the EMH3T2R is 33 dBm, but this can be limited by the thermal performance of the PCB and the surrounding environment. It's recommended to perform thermal simulations and testing to ensure that the device operates within a safe temperature range.
Impedance matching can be implemented using a combination of series and shunt components, such as capacitors, inductors, and resistors. ROHM provides a reference design and a impedance matching guide in the application note, which can be used as a starting point for impedance matching.
The recommended operating temperature range for the EMH3T2R is -40°C to 85°C, but the device can operate up to 125°C with reduced performance and reliability. It's recommended to perform thermal simulations and testing to ensure that the device operates within a safe temperature range.
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EMH3T2R Overview
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