ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
Use a soldering iron with a temperature of 350°C (662°F) or less, and a solder with a melting point of 220°C (428°F) or higher. Apply a small amount of solder paste to the thermal pad and reflow according to the recommended profile.
The maximum allowed voltage for the EMH61T2R is 63V, but it's recommended to operate within the specified voltage range of 12V to 42V for optimal performance and reliability.
The EMH61T2R is rated for operation up to 150°C (302°F), but derating is required above 125°C (257°F). Consult the datasheet for specific derating curves and ensure proper thermal management.
Implement overcurrent protection (OCP) and overvoltage protection (OVP) circuits, and consider adding a thermal shutdown or overtemperature protection (OTP) mechanism to prevent damage from excessive heat.
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