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EP2AGX260FF35I3N - Intel

Description: IC FPGA 612 I/O 1152FBGA

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EP2AGX260FF35I3N - Intel - PCB symbol
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EP2AGX260FF35I3N - Intel PCB footprint - BGA - BGA - EP2AGX260FF35I3N
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EP2AGX260FF35I3N - Intel - 3D model - BGA - EP2AGX260FF35I3N
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EP2AGX260FF35I3N Details

  • Manufacturer Part Number:

    EP2AGX260FF35I3N

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    35 X 35 MM, LEAD FREE, MS-034, FBGA-1152

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    500 MHz

  • JESD-30 Code:

    S-PBGA-B1152

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Number of CLBs:

    10260

  • Number of Inputs:

    612

  • Number of Logic Cells:

    244188

  • Number of Outputs:

    612

  • Number of Terminals:

    1152

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    10260 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HBGA

  • Package Equivalence Code:

    BGA1152,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.6 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    40 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    35 mm

EP2AGX260FF35I3N Frequently Asked Questions (FAQs)

  • The maximum power consumption of EP2AGX260FF35I3N is approximately 25W, but it can vary depending on the specific use case and operating conditions.
  • To optimize the performance of EP2AGX260FF35I3N, ensure proper cooling, use the optimal clock frequency, and optimize the design for parallel processing. Additionally, use Intel's optimization tools and guidelines to maximize performance.
  • The maximum operating temperature of EP2AGX260FF35I3N is 100°C (212°F), but it's recommended to operate within a temperature range of 0°C to 85°C (32°F to 185°F) for optimal performance and reliability.
  • Yes, EP2AGX260FF35I3N is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its rugged design and ability to operate in harsh environments.
  • To ensure the security of your design using EP2AGX260FF35I3N, implement secure boot mechanisms, use encryption and secure communication protocols, and follow Intel's security guidelines and recommendations.

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EP2AGX260FF35I3N Overview

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EP2AGX260FF35I3N Alternates

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Part Image EP2AGX260FF35I3 Intel Corporation

Field Programmable Gate Array, 10260 CLBS, 244188-Cell, PBGA1152