- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for EP2AGX45DF25C6N
- Part Number EP2AGX45DF25C6N
- Manufacturer Intel
- Pin Count 572
- Part Category Integrated Circuit
- Package Category BGA
- Footprint Name BGA - EP2AGX45
- Released Date Jul 28, 2020
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
EP2AGX45DF25C6N Details
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Manufacturer Part Number:
EP2AGX45DF25C6N
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Part Life Cycle Code:
Obsolete
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Package Description:
25 X 25 MM, LEAD FREE, MS-034, FBGA-572
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HTS Code:
8542.31.00.60
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Manufacturer:
Intel Corporation
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YTEOL:
0
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Clock Frequency-Max:
500 MHz
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JESD-30 Code:
S-PBGA-B572
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JESD-609 Code:
e1
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Length:
25 mm
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Moisture Sensitivity Level:
3
EP2AGX45DF25C6N Frequently Asked Questions (FAQs)
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The maximum power consumption of EP2AGX45DF25C6N is approximately 25W, but it can vary depending on the specific use case and operating conditions.
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To optimize thermal design, ensure good airflow around the device, use a heat sink with a thermal interface material, and consider using a fan or other cooling solutions. Intel also provides thermal design guidelines in the datasheet.
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Intel provides a recommended PCB layout and stackup in the datasheet, which includes guidelines for signal integrity, power integrity, and thermal management. It's essential to follow these guidelines to ensure optimal performance and reliability.
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To mitigate signal integrity and EMI issues, use controlled impedance routing, add decoupling capacitors, and implement EMI shielding. Intel also provides guidelines for signal integrity and EMI mitigation in the datasheet.
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The recommended operating conditions for EP2AGX45DF25C6N include an operating temperature range of 0°C to 100°C, a voltage supply range of 0.95V to 1.05V, and a clock frequency range of 50 MHz to 500 MHz.
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EP2AGX45DF25C6N Overview
Use the download button to access the EP2AGX45DF25C6N schematic symbol, PCB footprint, and 3D model.
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