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EP2AGX65DF29C6N - Intel

Description: Arria II GX Field Programmable Gate Array (FPGA) IC 364 5371904 60214 780-BBGA, FCBGA

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EP2AGX65DF29C6N - Intel PCB footprint - BGA - BGA - 780-FBGA (29x29)-1
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EP2AGX65DF29C6N - Intel  - 3D model - BGA - 780-FBGA (29x29)-1
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EP2AGX65DF29C6N Details

  • Manufacturer Part Number:

    EP2AGX65DF29C6N

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    29 X 29 MM, LEAD FREE, MS-034, FBGA-780

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    500 MHz

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    29 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    2530

  • Number of Inputs:

    372

  • Number of Logic Cells:

    60214

  • Number of Outputs:

    372

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    85 °C

  • Organization:

    2530 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HBGA

  • Package Equivalence Code:

    BGA780,28X28,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.7 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    40 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    29 mm

EP2AGX65DF29C6N Frequently Asked Questions (FAQs)

  • The maximum power consumption of EP2AGX65DF29C6N is approximately 25W, but it can vary depending on the specific use case and operating conditions.
  • To optimize the performance of EP2AGX65DF29C6N, ensure proper cooling, use the optimal clock frequency, and optimize the design for parallel processing. Additionally, use Intel's Quartus Prime software to optimize the FPGA design.
  • The maximum operating temperature of EP2AGX65DF29C6N is 100°C (212°F), but it's recommended to operate within the commercial temperature range of 0°C to 85°C (32°F to 185°F) for optimal performance and reliability.
  • To ensure signal integrity in EP2AGX65DF29C6N designs, use proper PCB design techniques, such as using differential pairs, adding termination resistors, and minimizing signal routing distances. Additionally, use Intel's signal integrity analysis tools to simulate and optimize signal integrity.
  • The maximum bandwidth of EP2AGX65DF29C6N is approximately 1440 Gbps, depending on the specific configuration and use case.

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EP2AGX65DF29C6N Overview

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