Please enter a minimum 3 letters or numbers
Technical Content
Part Image

EP2AGX95DF25I5 - Intel

Description: IC FPGA 260 I/O 572FBGA

Download EP2AGX95DF25I5 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
EP2AGX95DF25I5 - Intel - PCB symbol
click to zoom
PCB Footprints
EP2AGX95DF25I5 - Intel PCB footprint - BGA - BGA - 572-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Lidless - A:2.20
click to zoom
3D Models
EP2AGX95DF25I5 - Intel - 3D model - BGA - 572-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Lidless - A:2.20
click to zoom

EP2AGX95DF25I5 Details

  • Manufacturer Part Number:

    EP2AGX95DF25I5

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FBGA-572

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • JESD-30 Code:

    S-PBGA-B572

  • Length:

    25 mm

  • Number of Inputs:

    260

  • Number of Logic Cells:

    89178

  • Number of Outputs:

    260

  • Number of Terminals:

    572

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    3747 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA572,24X24,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.2 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    25 mm

EP2AGX95DF25I5 Frequently Asked Questions (FAQs)

  • The maximum power consumption of EP2AGX95DF25I5 is around 25W, but it can vary depending on the specific use case and operating conditions.
  • To optimize the performance of EP2AGX95DF25I5, you can use Intel's Quartus Prime software to optimize the design for power, area, and speed. Additionally, you can use techniques such as pipelining, parallel processing, and clock domain crossing to improve performance.
  • The maximum operating temperature of EP2AGX95DF25I5 is 100°C, but it's recommended to operate it at a temperature below 85°C for optimal performance and reliability.
  • Yes, EP2AGX95DF25I5 is suitable for high-reliability applications such as aerospace, defense, and industrial control systems. It has undergone rigorous testing and meets various industry standards for reliability and quality.
  • To ensure signal integrity in EP2AGX95DF25I5-based designs, you should follow Intel's guidelines for signal integrity, use proper PCB design techniques, and simulate the design using tools such as IBIS and S-Parameter models.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

EP2AGX95DF25I5 Overview

Use the download button to access the EP2AGX95DF25I5 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like EP2AG, or try a keyword search, such as Field Programmable Gate Arrays

Parts related to EP2AGX95DF25I5

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑

EP2AGX95DF25I5 Alternates

Showing results

Image Part Number Model
Part Image EP2AGX95DF25C5 Intel Corporation

Field Programmable Gate Array, 3747 CLBS, 89178-Cell, CMOS, PBGA572