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EP2AGX95DF25I5N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Arria II GX 3747 LABs 260 IOs

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PCB Footprints
EP2AGX95DF25I5N - Intel PCB footprint - BGA - BGA - 572-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Lidless - A:2.20
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EP2AGX95DF25I5N - Intel  - 3D model - BGA - 572-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Lidless - A:2.20
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EP2AGX95DF25I5N Details

  • Manufacturer Part Number:

    EP2AGX95DF25I5N

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    25 X 25 MM, LEAD FREE, MS-034, FBGA-572

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    500 MHz

  • JESD-30 Code:

    S-PBGA-B572

  • JESD-609 Code:

    e1

  • Length:

    25 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    3747

  • Number of Inputs:

    260

  • Number of Logic Cells:

    89178

  • Number of Outputs:

    260

  • Number of Terminals:

    572

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    3747 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HBGA

  • Package Equivalence Code:

    BGA572,24X24,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.2 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    40 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    25 mm

EP2AGX95DF25I5N Frequently Asked Questions (FAQs)

  • The maximum power consumption of EP2AGX95DF25I5N is approximately 25W, but it can vary depending on the specific use case and operating conditions.
  • To optimize the performance of EP2AGX95DF25I5N, ensure proper cooling, use the optimal clock frequency, and optimize the design for parallel processing. Additionally, consider using Intel's optimization tools and guidelines.
  • The maximum operating temperature of EP2AGX95DF25I5N is 100°C (212°F), but it's recommended to operate within a temperature range of 0°C to 85°C (32°F to 185°F) for optimal performance and reliability.
  • Yes, EP2AGX95DF25I5N is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its rugged design and compliance with various industry standards.
  • To ensure the security of your design using EP2AGX95DF25I5N, implement secure boot mechanisms, use encryption and secure communication protocols, and follow Intel's security guidelines and recommendations.

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EP2AGX95DF25I5N Overview

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Part Image EP2AGX95DF25C5 Intel Corporation

Field Programmable Gate Array, 3747 CLBS, 89178-Cell, CMOS, PBGA572