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EP2AGX95EF29C5N - Intel

Description: IC FPGA 372 I/O 780FBGA

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PCB Footprints
EP2AGX95EF29C5N - Intel PCB footprint - BGA - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Lidless - A:2.60
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EP2AGX95EF29C5N - Intel  - 3D model - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Lidless - A:2.60
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EP2AGX95EF29C5N Details

  • Manufacturer Part Number:

    EP2AGX95EF29C5N

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    29 X 29 MM, LEAD FREE, MS-034, FBGA-780

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    500 MHz

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    29 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    93675

  • Number of Inputs:

    372

  • Number of Logic Cells:

    89178

  • Number of Outputs:

    372

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    85 °C

  • Organization:

    93675 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HBGA

  • Package Equivalence Code:

    BGA780,28X28,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.7 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    40 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    29 mm

EP2AGX95EF29C5N Frequently Asked Questions (FAQs)

  • The maximum power consumption of EP2AGX95EF29C5N is around 25W, but it can vary depending on the specific use case and operating conditions.
  • To optimize the performance of EP2AGX95EF29C5N, you can use Intel's Quartus Prime software to optimize the FPGA design, use pipelining and parallel processing, and minimize memory access latency.
  • The maximum operating temperature of EP2AGX95EF29C5N is 100°C, but it's recommended to operate it at a temperature below 85°C for optimal performance and reliability.
  • Yes, EP2AGX95EF29C5N is suitable for high-speed data processing applications due to its high clock frequency, low latency, and high-bandwidth memory interfaces.
  • To ensure the reliability and fault tolerance of EP2AGX95EF29C5N, you can use error correction codes, implement redundancy, and use Intel's built-in reliability features such as CRC and ECC.

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EP2AGX95EF29C5N Overview

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Image Part Number Model
Part Image EP2AGX95EF29C5N Altera Corporation

Field Programmable Gate Array, 93675 CLBs, 500MHz, 89178-Cell, CMOS, PBGA780

Part Image EP2AGX95EF29C5 Altera Corporation

Field Programmable Gate Array, 89178-Cell, CMOS, PBGA780