EP2SGX30DF780C3N - Intel

EP2SGX30DF780C3N Details

• Manufacturer Part Number:

  EP2SGX30DF780C3N

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  29 X 29 MM, 1 MM PITCH, LEAD FREE, MS-034AAM-1, FBGA-780

• HTS Code:

  8542.31.00.60

• Manufacturer:

  Intel Corporation

• YTEOL:

  0

• Clock Frequency-Max:

  717 MHz

• Combinatorial Delay of a CLB-Max:

  4.45 ns

• JESD-30 Code:

  S-PBGA-B780

• JESD-609 Code:

  e1

• Length:

  29 mm

• Moisture Sensitivity Level:

  3

• Number of CLBs:

  33880

• Number of Inputs:

  361

• Number of Logic Cells:

  33880

• Number of Outputs:

  361

• Number of Terminals:

  780

• Operating Temperature-Max:

  85 °C

• Organization:

  33880 CLBS

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA780,28X28,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Programmable Logic Type:

  FIELD PROGRAMMABLE GATE ARRAY

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  3.5 mm

• Supply Voltage-Max:

  1.25 V

• Supply Voltage-Min:

  1.15 V

• Supply Voltage-Nom:

  1.2 V

• Surface Mount:

  YES

• Technology:

  CMOS, 90 nm

• Temperature Grade:

  OTHER

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Width:

  29 mm