Part Image

EP3C16F484C6 - Intel

Description: FPGA Cyclone® III Family 15408 Cells 500MHz 65nm Technology 1.2V 484-Pin FBGA Tray

Download EP3C16F484C6 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
EP3C16F484C6 - Intel PCB footprint - BGA - BGA - 484-Pin FineLine Ball-Grid Array (FBGA)
click to zoom
3D Models
EP3C16F484C6 - Intel  - 3D model - BGA - 484-Pin FineLine Ball-Grid Array (FBGA)
click to zoom

EP3C16F484C6 Details

  • Manufacturer Part Number:

    EP3C16F484C6

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    23 X 23 MM, 2.60 MM HEIGHT, 1 MM PITCH, FBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • Clock Frequency-Max:

    472.5 MHz

  • JESD-30 Code:

    R-PBGA-B484

  • JESD-609 Code:

    e0

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    15408

  • Number of Inputs:

    346

  • Number of Logic Cells:

    15408

  • Number of Outputs:

    346

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    15408 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.6 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

EP3C16F484C6 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the EP3C16F484C6 is -40°C to 100°C (industrial grade) and -40°C to 85°C (commercial grade).
  • To implement a clock tree in the EP3C16F484C6, use the Quartus II software to create a clock network that meets the device's clocking requirements. The software will help you to optimize the clock tree for skew, jitter, and other performance metrics.
  • The maximum frequency that the EP3C16F484C6 can operate at is 500 MHz, but this can vary depending on the specific application and design requirements.
  • To configure the I/O banks in the EP3C16F484C6, use the Quartus II software to assign I/O standards, voltage levels, and other settings to each bank according to your design requirements.
  • The power consumption of the EP3C16F484C6 varies depending on the specific application, clock frequency, and other factors. However, the typical power consumption is around 1.2W to 2.5W.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

EP3C16F484C6 Overview

Use the download button to access the EP3C16F484C6 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like EP3C1, or try a keyword search, such as Field Programmable Gate Arrays

Parts related to EP3C16F484C6

Showing 0 results

EP3C16F484C6 Alternates

Showing results

Image Part Number Model
Part Image EP3C16F484C6N Intel Corporation

Field Programmable Gate Array, 15408 CLBs, 472.5MHz, 15408-Cell, CMOS, PBGA484

Part Image EP3C16F484C6 Altera Corporation

Field Programmable Gate Array, 15408 CLBs, 472.5MHz, 15408-Cell, CMOS, PBGA484