EP3C25F256C8N - Intel

EP3C25F256C8N Details

• Manufacturer Part Number:

  EP3C25F256C8N

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Transferred

• Package Description:

  17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256

• Country Of Origin:

  Mainland China, Malaysia, Taiwan, USA, Vietnam

• ECCN Code:

  EAR99

• HTS Code:

  8542.39.00.01

• Manufacturer:

  Intel Corporation

• YTEOL:

  10

• Clock Frequency-Max:

  472.5 MHz

• JESD-30 Code:

  R-PBGA-B256

• JESD-609 Code:

  e1

• Length:

  17 mm

• Moisture Sensitivity Level:

  3

• Number of CLBs:

  24624

• Number of Inputs:

  156

• Number of Logic Cells:

  24624

• Number of Outputs:

  156

• Number of Terminals:

  256

• Operating Temperature-Max:

  85 °C

• Organization:

  24624 CLBS

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LBGA

• Package Equivalence Code:

  BGA256,16X16,40

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, LOW PROFILE

• Peak Reflow Temperature (Cel):

  260

• Programmable Logic Type:

  FIELD PROGRAMMABLE GATE ARRAY

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.55 mm

• Supply Voltage-Max:

  1.25 V

• Supply Voltage-Min:

  1.15 V

• Supply Voltage-Nom:

  1.2 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  OTHER

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  17 mm