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EP4CE30F29C8N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone IV E 1803 LABs 532 IOs

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EP4CE30F29C8N - Intel PCB footprint - BGA - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40
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3D Models
EP4CE30F29C8N - Intel  - 3D model - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40
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EP4CE30F29C8N Details

  • Manufacturer Part Number:

    EP4CE30F29C8N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Additional Feature:

    IT CAN ASO OPERATE AT 1.2V SUPPLY

  • Clock Frequency-Max:

    472.5 MHz

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    29 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    28848

  • Number of Inputs:

    535

  • Number of Logic Cells:

    28848

  • Number of Outputs:

    535

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    85 °C

  • Organization:

    28848 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA780,28X28,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.6 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    29 mm

EP4CE30F29C8N Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the EP4CE30F29C8N is -40°C to 100°C.
  • To implement a CDC in the EP4CE30F29C8N, use a synchronizer circuit or a FIFO-based CDC to ensure data integrity and prevent metastability issues.
  • The maximum frequency supported by the EP4CE30F29C8N is 500 MHz.
  • To optimize power consumption in the EP4CE30F29C8N, use power-aware design techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
  • Yes, the EP4CE30F29C8N is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its high reliability and fault tolerance features.

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EP4CE30F29C8N Overview

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Part Image EP4CE30F29I8LN Intel Corporation

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Part Image EP4CE30F29I8L Intel Corporation

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