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EP4CE40U19I7N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone IV E 2475 LABs 328 IOs

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PCB Footprints
EP4CE40U19I7N - Intel PCB footprint - BGA - BGA - 484-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:2.05
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EP4CE40U19I7N - Intel  - 3D model - BGA - 484-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:2.05
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EP4CE40U19I7N Details

  • Manufacturer Part Number:

    EP4CE40U19I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    19 X 19 MM, 0.80 MM PITCH, LEAD FREE, UBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Clock Frequency-Max:

    472.5 MHz

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    2475

  • Number of Inputs:

    328

  • Number of Logic Cells:

    39600

  • Number of Outputs:

    328

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2475 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA484,22X22,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.05 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

EP4CE40U19I7N Frequently Asked Questions (FAQs)

  • The EP4CE40U19I7N has an industrial temperature range of -40°C to 100°C, making it suitable for use in a wide range of environments.
  • To implement a CDC in the EP4CE40U19I7N, you can use the FPGA's built-in clock domain crossing circuits, or use a synchronous FIFO to transfer data between clock domains. You can also use Intel's Quartus II software to help implement CDCs.
  • The maximum frequency achievable with the EP4CE40U19I7N depends on the specific design and implementation. However, Intel's datasheet specifies a maximum clock frequency of 500 MHz for this device.
  • To optimize power consumption in your EP4CE40U19I7N design, you can use Intel's PowerPlay power analysis and optimization tool, which is part of the Quartus II software. You can also use techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
  • To implement a DDR3 memory interface in the EP4CE40U19I7N, you can use Intel's UniPHY IP core, which provides a pre-verified and optimized DDR3 interface. You can also use third-party IP cores or implement a custom DDR3 interface using the FPGA's resources.

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