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EP4CE6F17C6 - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone IV E 392 LABs 179 IOs

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EP4CE6F17C6 - Intel - PCB symbol
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PCB Footprints
EP4CE6F17C6 - Intel PCB footprint - BGA - BGA - 256-Pin FineLine Ball-Grid Array (FBGA)
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3D Models
EP4CE6F17C6 - Intel - 3D model - BGA - 256-Pin FineLine Ball-Grid Array (FBGA)
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EP4CE6F17C6 Details

  • Manufacturer Part Number:

    EP4CE6F17C6

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    17 X 17 MM, 1 MM PITCH, FBGA-256

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Clock Frequency-Max:

    472.5 MHz

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e0

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    392

  • Number of Inputs:

    179

  • Number of Logic Cells:

    6272

  • Number of Outputs:

    179

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Organization:

    392 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

EP4CE6F17C6 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for EP4CE6F17C6 is -40°C to 100°C (industrial grade) and -40°C to 85°C (commercial grade).
  • To implement a clock tree in EP4CE6F17C6, use the Intel Quartus II software to create a clock network that meets the device's clocking requirements. The software provides tools to analyze and optimize the clock tree for optimal performance and skew.
  • The maximum current draw for EP4CE6F17C6 is approximately 1.2A for the core voltage (VCCINT) and 0.5A for the I/O voltage (VCCIO). However, the actual current draw depends on the device's operating frequency, voltage, and usage.
  • To configure the I/O banks in EP4CE6F17C6, use the Intel Quartus II software to assign I/O standards, voltage, and termination to each I/O bank. The software provides a graphical interface to configure the I/O banks and ensure compatibility with external devices.
  • The minimum power-on reset (POR) time for EP4CE6F17C6 is 10ms. This ensures that the device has sufficient time to initialize and stabilize before the POR signal is released.

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EP4CE6F17C6 Overview

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