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EP4CE6F17C8N - Intel

Description: FPGA, Cyclone IV E, 6272 cell, TFBGA256 EP4CE6F17C8N, FPGA Cyclone 6272 Cells, 6272 Gates, 276480, 392 Blocks, 1.15 → 1.25 V 256-Pin FBGA

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PCB Footprints
EP4CE6F17C8N - Intel PCB footprint - BGA - BGA - 256 pin FBGA-1
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EP4CE6F17C8N - Intel  - 3D model - BGA - 256 pin FBGA-1
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EP4CE6F17C8N Details

  • Manufacturer Part Number:

    EP4CE6F17C8N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Clock Frequency-Max:

    472.5 MHz

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    392

  • Number of Inputs:

    179

  • Number of Logic Cells:

    6272

  • Number of Outputs:

    179

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Organization:

    392 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

EP4CE6F17C8N Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the EP4CE6F17C8N is -40°C to 100°C.
  • To implement a clock domain crossing (CDC) in the EP4CE6F17C8N, use a synchronizer circuit or a FIFO-based CDC to ensure data integrity and prevent metastability issues.
  • The recommended power-on reset (POR) circuit for the EP4CE6F17C8N is a simple RC circuit with a 1 kΩ resistor and a 10 μF capacitor, which provides a minimum reset pulse width of 10 ms.
  • To optimize the EP4CE6F17C8N for low power consumption, use the Intel Quartus II software to enable the 'Low Power Synthesis' option, and implement power-gating techniques, such as clock gating and voltage scaling.
  • The maximum current rating for the EP4CE6F17C8N is 500 mA for the core voltage (VCC) and 100 mA for the auxiliary voltage (VCCAUX).

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EP4CE6F17C8N Overview

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Part Image EP4CE6F17C8 Intel Corporation

Field Programmable Gate Array, 392 CLBs, 472.5MHz, 6272-Cell, PBGA256