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EP4CE75F23I8LN - Intel

Description: FPGA - Field Programmable Gate Array

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PCB Footprints
EP4CE75F23I8LN - Intel PCB footprint - BGA - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40
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EP4CE75F23I8LN - Intel  - 3D model - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40
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EP4CE75F23I8LN Details

  • Manufacturer Part Number:

    EP4CE75F23I8LN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Clock Frequency-Max:

    362 MHz

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    4713

  • Number of Inputs:

    295

  • Number of Logic Cells:

    75408

  • Number of Outputs:

    295

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4713 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.4 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

EP4CE75F23I8LN Frequently Asked Questions (FAQs)

  • The EP4CE75F23I8LN has an operating temperature range of -40°C to 100°C.
  • To implement a CDC in the EP4CE75F23I8LN, use a synchronizer circuit or a FIFO-based CDC, and ensure that the clock domains are properly isolated.
  • The maximum frequency achievable with the EP4CE75F23I8LN depends on the specific design and implementation, but it can reach up to 500 MHz.
  • To optimize power consumption in the EP4CE75F23I8LN, use power-aware design techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
  • Yes, the EP4CE75F23I8LN is suitable for high-reliability applications, such as aerospace and defense, due to its radiation-hardened design and error correction capabilities.

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EP4CE75F23I8LN Overview

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Image Part Number Model
Part Image EP4CE75F23I8L Intel Corporation

Field Programmable Gate Array, 4713 CLBs, 362MHz, 75408-Cell, PBGA484

Part Image EP4CE75F23I8LN Altera Corporation

Field Programmable Gate Array, 4713 CLBs, 362MHz, 75408-Cell, PBGA484

Part Image EP4CE75F23C8LN Altera Corporation

Field Programmable Gate Array, 4713 CLBs, 362MHz, 75408-Cell, PBGA484