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EP4CE75F29C8N - Intel

Description: FPGA Cyclone® IV E Family 75408 Cells 60nm Technology 1.2V 780-Pin FBGA

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EP4CE75F29C8N - Intel PCB footprint - BGA - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Channel Lid - A:3.50
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EP4CE75F29C8N - Intel  - 3D model - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Channel Lid - A:3.50
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EP4CE75F29C8N Details

  • Manufacturer Part Number:

    EP4CE75F29C8N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Clock Frequency-Max:

    472.5 MHz

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    29 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    4713

  • Number of Inputs:

    429

  • Number of Logic Cells:

    75408

  • Number of Outputs:

    429

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    85 °C

  • Organization:

    4713 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA780,28X28,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.4 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    29 mm

EP4CE75F29C8N Frequently Asked Questions (FAQs)

  • The EP4CE75F29C8N has an industrial temperature range of -40°C to 100°C, making it suitable for use in a wide range of environments.
  • To implement a CDC in the EP4CE75F29C8N, you can use the FPGA's built-in clock domain crossing circuits, such as the CDC FIFO or the asynchronous FIFO. You can also use synchronization circuits like the synchronizer or the double-flop synchronizer.
  • The maximum frequency achievable with the EP4CE75F29C8N depends on the specific design and the clocking architecture used. However, Intel's Quartus II software can help you estimate the maximum frequency achievable for your design.
  • To optimize power consumption in your EP4CE75F29C8N design, you can use various techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling. You can also use Intel's PowerPlay power analysis and optimization tool to identify areas of high power consumption and optimize your design accordingly.
  • The EP4CE75F29C8N has a total of 7,257,344 bits of memory, comprising 372,032 logic elements (LEs) and 2,554,112 bits of RAM.

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