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EP4SE230F29C2N - Intel

Description: FPGA Stratix® IV E Family 228000 Cells 40nm Technology 0.9V 780-Pin FC-FBGA

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EP4SE230F29C2N - Intel PCB footprint - BGA - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Channel Lid - A:3.40
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EP4SE230F29C2N - Intel  - 3D model - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Channel Lid - A:3.40
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EP4SE230F29C2N Details

  • Manufacturer Part Number:

    EP4SE230F29C2N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    29 X 29 MM, LEAD FREE, FBGA-780

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    800 MHz

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    29 mm

  • Number of CLBs:

    9120

  • Number of Inputs:

    488

  • Number of Logic Cells:

    228000

  • Number of Outputs:

    488

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    85 °C

  • Organization:

    9120 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA780,28X28,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.4 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    29 mm

EP4SE230F29C2N Frequently Asked Questions (FAQs)

  • The maximum junction temperature (Tj) for EP4SE230F29C2N is 100°C, as specified in the Intel FPGA datasheet.
  • Intel recommends using an external POR circuit with a voltage supervisor IC, such as the MAX809, to ensure a reliable power-on reset. The FPGA's internal POR circuit may not be sufficient for all applications.
  • Intel provides guidelines for PCB layout and routing in the Intel FPGA PCB Design Guidelines document. It's essential to follow these guidelines to ensure signal integrity, reduce noise, and meet timing requirements.
  • To optimize power consumption, use the Intel PowerPlay Early Power Estimator (EPE) tool to estimate power consumption based on your design. Then, implement power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
  • Intel provides guidelines for configuration and programming in the Intel FPGA Configuration Handbook. It's essential to follow these guidelines to ensure successful configuration and programming of the FPGA.

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EP4SE230F29C2N Overview

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Part Image EP4SE230F29C2 Altera Corporation

Field Programmable Gate Array, 9120 CLBs, 800MHz, 228000-Cell, CMOS, PBGA780

Part Image EP4SE230F29C2 Intel Corporation

Field Programmable Gate Array, 9120 CLBs, 800MHz, 228000-Cell, CMOS, PBGA780