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EP4SGX530NF45C2N - Intel

Description: Stratix® IV GX Field Programmable Gate Array (FPGA) IC 920 28033024 531200 1932-BBGA, FCBGA

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PCB Footprints
EP4SGX530NF45C2N - Intel PCB footprint - BGA - BGA - 1932-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.50
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3D Models
EP4SGX530NF45C2N - Intel  - 3D model - BGA - 1932-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.50
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EP4SGX530NF45C2N Details

  • Manufacturer Part Number:

    EP4SGX530NF45C2N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FBGA-1932

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • JESD-30 Code:

    S-PBGA-B1932

  • JESD-609 Code:

    e1

  • Length:

    45 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    21248

  • Number of Inputs:

    920

  • Number of Logic Cells:

    531200

  • Number of Outputs:

    920

  • Number of Terminals:

    1932

  • Operating Temperature-Max:

    85 °C

  • Organization:

    21248 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1932,44X44,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.5 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    40 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    45 mm

EP4SGX530NF45C2N Frequently Asked Questions (FAQs)

  • The maximum power consumption of EP4SGX530NF45C2N is around 25W, but it can vary depending on the specific use case and operating conditions.
  • To optimize the performance of EP4SGX530NF45C2N, you can use Intel's Quartus Prime software to optimize the design, reduce power consumption, and improve thermal performance. Additionally, you can use Intel's PowerPlay power management technology to dynamically adjust power consumption based on the system's workload.
  • The maximum operating temperature of EP4SGX530NF45C2N is 100°C, but it's recommended to operate it at a temperature below 85°C for optimal performance and reliability.
  • No, EP4SGX530NF45C2N is not a radiation-hardened device and is not suitable for use in high-radiation environments. If you need a radiation-hardened FPGA, you should consider Intel's radiation-hardened FPGA products, such as the RTG4 or the RTAX series.
  • To secure the boot process of EP4SGX530NF45C2N, you can use Intel's Secure Boot technology, which provides a secure boot mechanism that ensures the authenticity and integrity of the FPGA's configuration data. Additionally, you can use encryption and secure key storage to protect the FPGA's configuration data.

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EP4SGX530NF45C2N Overview

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Part Image EP4SGX530NF45C2 Altera Corporation

Field Programmable Gate Array, 212480 CLBs, 531200-Cell, CMOS, PBGA1932

Part Image EP4SGX530NF45C2G Intel Corporation

Field Programmable Gate Array, 21248 CLBs, 531200-Cell, PBGA1932

Part Image EP4SGX530NF45I2 Intel Corporation

Field Programmable Gate Array, 21248 CLBs, 800MHz, PBGA1932

Part Image EP4SGX530NF45C2 Intel Corporation

Field Programmable Gate Array, 21248 CLBs, 800MHz, 531200-Cell, CMOS, PBGA1932

Part Image EP4SGX530NF45C2ES Intel Corporation

Field Programmable Gate Array, 21248 CLBs, 800MHz, PBGA1932

For a full list of alternate parts for EP4SGX530NF45C2N, check out Findchips.com