- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for EP4SGX70DF29C2XG
- Part Number EP4SGX70DF29C2XG
- Manufacturer Intel
- Pin Count 780
- Part Category Integrated Circuit
- Package Category BGA
- Footprint Name BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Single-Piece Lid - A:3.30 - D1:21.0
- Released Date Sep 12, 2020
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
EP4SGX70DF29C2XG Details
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Manufacturer Part Number:
EP4SGX70DF29C2XG
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Rohs Code:
Yes
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Part Life Cycle Code:
Transferred
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Package Description:
FBGA-780
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Country Of Origin:
Mainland China, Malaysia, Taiwan, USA, Vietnam
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HTS Code:
8542.31.00.60
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Manufacturer:
Intel Corporation
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YTEOL:
10
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JESD-30 Code:
S-PBGA-B780
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Length:
29 mm
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Number of CLBs:
2904
EP4SGX70DF29C2XG Frequently Asked Questions (FAQs)
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The maximum power consumption of EP4SGX70DF29C2XG is around 12W, but it can vary depending on the specific use case and operating conditions.
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To optimize the performance of EP4SGX70DF29C2XG, you can use Intel's Quartus Prime software to optimize the FPGA design, use pipelining and parallel processing, and minimize memory access latency.
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The maximum operating temperature of EP4SGX70DF29C2XG is 100°C, but it's recommended to operate it at a temperature below 85°C for optimal performance and reliability.
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Yes, EP4SGX70DF29C2XG is suitable for high-speed data processing applications due to its high-speed transceivers, high-bandwidth memory interfaces, and optimized architecture for data processing.
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To ensure the reliability and fault tolerance of EP4SGX70DF29C2XG, you can use Intel's built-in error correction mechanisms, implement redundancy and fail-safe mechanisms in your design, and follow Intel's recommended design and testing guidelines.
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EP4SGX70DF29C2XG Overview
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