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- Stock & Prices $ Price & Stock for EP4SGX70HF35I4G
- Part Number EP4SGX70HF35I4G
- Manufacturer Intel
- Pin Count 1152
- Part Category Integrated Circuit
- Package Category BGA
- Footprint Name BGA - 1152-Pin FBGA - Flip Chip - Flat Top SPL - A:3.50
- Released Date Dec 3, 2020
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
EP4SGX70HF35I4G Details
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Manufacturer Part Number:
EP4SGX70HF35I4G
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Rohs Code:
Yes
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Part Life Cycle Code:
Transferred
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Package Description:
FBGA-1152
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Country Of Origin:
Mainland China, Malaysia, Taiwan, USA, Vietnam
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HTS Code:
8542.31.00.60
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Manufacturer:
Intel Corporation
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YTEOL:
10
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JESD-30 Code:
S-PBGA-B1152
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Length:
35 mm
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Number of CLBs:
2904
EP4SGX70HF35I4G Frequently Asked Questions (FAQs)
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The maximum power consumption of EP4SGX70HF35I4G is around 25W, but it can vary depending on the specific use case and operating conditions.
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To optimize the performance of EP4SGX70HF35I4G, you can use Intel's Quartus Prime software to optimize the design, reduce power consumption, and improve thermal performance. Additionally, you can use Intel's Power Analyzer to monitor and optimize power consumption.
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The maximum operating temperature of EP4SGX70HF35I4G is 100°C, but it's recommended to operate it at a temperature below 85°C for optimal performance and reliability.
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No, EP4SGX70HF35I4G is not a radiation-hardened device and is not suitable for use in high-radiation environments. If you need a radiation-hardened device, you should consider Intel's radiation-hardened FPGA products.
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To secure the boot process of EP4SGX70HF35I4G, you can use Intel's Secure Boot feature, which ensures that the device boots only with authorized firmware. You can also use encryption and secure key storage to protect the boot process.
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EP4SGX70HF35I4G Overview
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