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EPF10K10AQC208-2 - Intel

Description: FPGA FLEX 10KA Family 10K Gates 576 Cells 142.86MHz 0.3um Technology 3.3V 208-Pin PQFP

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EPF10K10AQC208-2 - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 208-BFQFP
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EPF10K10AQC208-2 - Intel  - 3D model - Quad Flat Packages - 208-BFQFP
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EPF10K10AQC208-2 Details

  • Manufacturer Part Number:

    EPF10K10AQC208-2

  • Rohs Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FQFP, QFP208,1.2SQ,20

  • Reach Compliance Code:

    Compliant

  • HTS Code:

    8542.31.00.55

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    576 LOGIC ELEMENTS; 72 LABS

  • Clock Frequency-Max:

    80 MHz

  • JESD-30 Code:

    S-PQFP-G208

  • JESD-609 Code:

    e0

  • Length:

    28 mm

  • Moisture Sensitivity Level:

    3

  • Number of Dedicated Inputs:

    4

  • Number of I/O Lines:

    134

  • Number of Inputs:

    134

  • Number of Logic Cells:

    576

  • Number of Outputs:

    134

  • Number of Terminals:

    208

  • Operating Temperature-Max:

    70 °C

  • Organization:

    4 DEDICATED INPUTS, 134 I/O

  • Output Function:

    REGISTERED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FQFP

  • Package Equivalence Code:

    QFP208,1.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, FINE PITCH

  • Programmable Logic Type:

    LOADABLE PLD

  • Propagation Delay:

    0.6 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.1 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    28 mm

EPF10K10AQC208-2 Frequently Asked Questions (FAQs)

  • Intel provides a PCB design guide for the EPF10K10AQC208-2, which includes recommendations for layout, routing, and signal integrity. It's essential to follow these guidelines to ensure optimal performance and minimize signal degradation.
  • Intel recommends a specific power-up and power-down sequence to ensure reliable operation. This involves sequencing the power supplies, configuring the FPGA, and monitoring the power-good signal. Refer to the Intel FPGA Power Management document for detailed guidelines.
  • The EPF10K10AQC208-2 has a thermal design power (TDP) of 2.5W. To manage thermal performance, ensure good airflow, use a heat sink if necessary, and follow Intel's thermal management guidelines. Monitor the FPGA's temperature using the built-in thermal diode or an external temperature sensor.
  • To minimize EMI and ensure signal integrity, follow Intel's guidelines for signal routing, termination, and shielding. Use differential signaling, keep clock lines short, and avoid routing signals near the FPGA's high-speed transceivers. Also, consider using EMI filters and shielding on the PCB.
  • The EPF10K10AQC208-2 can be configured using Intel's Quartus II software or the Intel FPGA SDK for OpenCL. Programming options include JTAG, AS, and PS mode. Refer to the Intel FPGA Configuration and Programming documentation for detailed information.

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EPF10K10AQC208-2 Overview

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